Heat management materials

Heat management materials

Thermally conductive materials based on silicones and epoxy resins are essential in modern electronics and electrical engineering. They play a critical role in dissipating heat from electronic components, ensuring stable performance and extending the service life of devices. These materials combine efficient thermal conductivity with electrical insulation and mechanical protection.

Typical Application Areas

  • Electronics Manufacturing: Thermally conductive potting compounds and encapsulants made from silicone or epoxy are used to protect sensitive components while enhancing heat dissipation in PCBs, power supplies, and electronic modules.

  • IC/LED/Chip Packaging: In semiconductor and LED packaging, these materials help distribute heat evenly and prevent overheating, especially in compact, high-power devices with limited space for passive cooling.

  • Thermal Pastes and Pads: Silicone-based thermal greases or epoxy gels are applied between components (e.g., between a chip and a heatsink) to fill microscopic air gaps and reduce thermal resistance for more efficient heat transfer.

  • Automotive and Power Electronics: In control units, battery systems, and sensors, thermally conductive materials ensure proper thermal management and consistent operation under variable and often harsh temperature conditions.

SiliconsEpoxy resins
ThermoSIL-100ThermoEP-100
ThermoSIL-120ThermoEP-428
ThermoSIL-150ThermoEP-170
ThermoSIL-200ThermoEP-350
ThermoSIL-200-2ThermoEP-150
ThermoSIL-280 
ThermoSIL-400 
ThermoFPD-475 
ThermoFPD-200-S35 
ThermoFPD-200-S65 
ThermoFPD-450-S75 
ThermoFPD-800-S80 
  • Wärmeleitfähige Materialien